Li-board tsa Smart Home tsa Taolo ea Elektroniki
Fumax e hlahisa litsamaiso tsa taolo ea elektroniki bakeng sa ts'ebeliso e bohlale ea lapeng.
Balaoli ba lisebelisoa tsa lapeng Boto ea taolo ea mochini oa lebese la soya, boto ea taolo ea setofo sa ceramic, boto ea taolo ea mamati ka tsela e iketsang, jj., boto ea taolo ea senotlolo sa motlakase, sistimi ea taolo ea phihlello e bohlale, jj.
Likarolo tsa liboto tsa taolo ea elektroniki tse bohlale lapeng:
(1) Ho aha sistimi e bohlale ea sethala sa lapeng ka heke ea lapeng le software ea sistimi ea eona
(2) Sethala se kopaneng
(3) Khokahano le lisebelisoa tsa lapeng ka li-module tsa kantle tsa keketso
(4) Ts'ebeliso ea sistimi e kenelletseng
Lehae le bohlale ke eng?
Ntlo eo ho thoeng ke bohlale lapeng e bua ka ho kopana ha lisebelisoa tsa lisebelisoa le bohlale ba maiketsetso. Seo ho thoeng ke terminal e bohlale kapa lisebelisoa tse bohlale indastering ke sehlahisoa se nang le ts'ebetso ea tlhaiso-leseling le khokahano ea data e ka bonang ts'ebetso ea ts'ebeletso ea ts'ebeliso / ts'ebelisano.
Molemo oa liboto tsa taolo ea elektroniki tse bohlale lapeng:
E sebetsang ebile e bonolo
E tloaelehileng
Loketseng
Bobebe
Bokhoni ba liboto tsa taolo ea elektroniki tse bohlale lapeng:
Boitsebiso ba Base: FR4 CEM1 CEM3 Hight TG
Botenya ba Koporo: 1 Oz
Botenya ba Boto: 1.0mm
Min. Hole Size: 3mil (0.075mm)
Min. Bophara ba Line: 0.05
Min. Sebaka sa Line: 0.1mm / 4mil
Holim qete: qoelisoa khauta / HASL / OSP
Maske ea Solder: botala / botsho / khubelu / putsoa / tšoeu / bosehla
Litifikeiti: CE / ROHS / FCC / ISO9001 / IPC-610B
QFP Pele sekontiri se metsi: 0.38mm ~ 2.54mm
Min. IC sekontiri se metsi: 0.30mm
Teko: Teko ea Patlo ea Lifofane, Tlhahlobo ea X-ray Tlhahlobo ea AOI
Tloaelo ea ho nts'etsapele ntlo e bohlale:
Melao ea taolo ea tikoloho le polokeho;
Ts'ebeliso ea mahlale a macha le likarolo tse ncha;
Ho kopanya le gridi e bohlale.
