micro chip scanning

Fumax Tech e fana ka boleng ba boleng bo holimo ba ho hatisa maboto a potoloho (PCB) ho kenyeletsoa le li-PCB tse ngata (tse hatisitsoeng tsa boto ea potoloho), boemo bo phahameng ba HDI (sehokedi se phahameng sa sehokelo), PCB e ikhethileng le PCB e sa tenyetseheng… jj.

E le thepa ea motheo, Fumax e utloisisa bohlokoa ba boleng bo tšepahalang ba PCB. Re tsetela ho lisebelisoa tse ntlehali le sehlopha se nang le talenta ho hlahisa liboto tsa boleng bo holimo.

Likarolo tse tloaelehileng tsa PCB li ka tlase.

Tenyetseheng PCB

Tenyetsehang & thata Flex PCBs

HDI PCB

Phahameng maqhubu PCB

TG PCB e phahameng

LED ea PCB

Metal konokono PCB

Thick Cooper PCB

Aluminium PCB

 

Bokgoni ba rona ba tlhahiso bo bontšoa chate e ka tlase.

Tlanya

Bokgoni

Boholo

Li-multilayers (4-28), HDI (4-20) Flex, Flex e thata

Lehlakore le habeli

CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil – 126mil (0.1mm-3.2mm)

Li-multilayers

Dikarolo 4-28, boto botenya 8mil-126mil, 0.2mm-3.2mm

Pata / Foufala ka Via

4-20 dikarolo, boto botenya 10mil-126mil (0.25mm-3.2mm)

HDI

1 + N + 1、2 + N + 2、3 + N + 3 、 lera lefe kapa lefe

Flex & Tenyetseheng-Flex PCB

1-8layers Flex PCB, 2-12layers Tenyetseheng-Flex PCB HDI + thata-Flex PCB

Laminate

 

Mofuta oa Soldermask (LPI)

Taiyo 、 Goo's im Mohloli oa FPC .....

Peelable Soldermask

 

Enke ea k'habone

 

HASL / Etella Pele HASL

Botenya: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nikele palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Electro. Khauta e Thata

 

Thini e teteaneng

 

Bokgoni

Tlhahiso ea Mass

Min Mechanical go tirila Hole

0.20mm

Min. Laser go tirila Hole

4mil (0.100mm)

Bophara ba Line / Spacing

2mil / 2mil

Boholo. Boholo ba Panel

21.5 "X 24.5" (546mm X 622mm)

Bophara ba Line / Spacing Mamello

Liaparo tsa elektronike tse se nang motlakase: +/- 5um, Electro barging: +/- 10um

PTH Hole Mamello

+/- 0.002inch (0.050mm)

NPTH Hole Mamello

+/- 0.002inch (0.050mm)

Mamello ea Sebaka sa Hole

+/- 0.002inch (0.050mm)

Hole ho mamella Edge

+/- 0.004inch (0.100mm)

Mamello ho isa bohole mamello

+/- 0.004inch (0.100mm)

Lera ho lera mamello

+/- 0.003inch (0.075mm)

Mamello Impedance

+/- 10%

Leqheka%

Max≤0.5%

Theknoloji (Sehlahisoa sa HDI)

NTHO

Tlhahiso

Laser Via tirila / Pad

0,25 / 0,30, 0,25 / 0,38

Blind Via Drill / Pad

0.25 / 0.50

Bophara ba Line / Spacing

0.10 / 0.10

Tlhahiso ea Hole

CO2 Laser Direct Drill

Haha Boitsebiso

FR4 LDP (LDD); RCC 50 ~ 100 micron

Cu botenya leboteng la Hole

Hole e Foufetseng: 10um (mets)

Tšobotsi karo-karolelano

0.8: 1

Technology (tenyetsehang PCB)

Morero 

Bokgoni

Rōlela ho rōlela (lehlakoreng le leng)

EE

Rōlela ho rōlela (habeli)

Che

Moqolo oa ho tsamaisa bophara ba limilimithara 

250

Bonyane ba boholo ba tlhahiso ea mm 

250x250 

Boholo bo boholo ba tlhahiso ea mm 

500x500 

Patch ea Kopano ea SMT (E / Che)

EE

Bokhoni ba Lekhalo la Moea (E / Che)

EE

Tlhahiso ea poleiti e tlamang e thata ebile e bonolo (E / Che)

EE

Dikarolo Max (Thata)

10

Lera le lelelele ka ho fetesisa (poleiti e bonolo)

6

Boitsebiso ba Saense 

 

PI

EE

PET

EE

Koporo ea motlakase

EE

Foil ea koporo ea Anneal e phuthetsoe

EE

PI

 

Ho koahela tokiso ea mamello ea filimi mm

± 0.1 

Bonyane ba koahela mm mm

0.175

Matlafatso 

 

PI

EE

FR-4

EE

SUS

EE

EMI LITEBO

 

Inki ea Silevera

EE

Filimi ea Silevera

EE