ho hlahlojoa ha microchip

Fumax Tech e fana ka Liboto tsa Potoloho ea Khatiso ea boleng bo holimo (PCB) ho kenyelletsa PCB ea mekhahlelo e mengata (boto ea potoloho e hatisitsoeng), HDI ea boemo bo holimo (sehokelo se phahameng sa sehokelo), PCB ea lera le likhohlano tse thata ... joalo-joalo.

E le thepa ea motheo, Fumax e utloisisa bohlokoa ba boleng bo tšepahalang ba PCB.Re tsetela ho lisebelisoa tse hloahloa le sehlopha se nang le talenta ho hlahisa liboto tsa boleng bo holimo.

Mefuta e tloaelehileng ea PCB e ka tlase.

PCB e thata

Flexible & Rigid Flex PCBs

HDI PCB

High Frequency PCB

TG PCB e phahameng

LED PCB

Metal core PCB

Thick Cooper PCB

Aluminium PCB

 

Bokhoni ba rona ba ho etsa lihlahisoa bo bontšitsoe chate e ka tlase.

Mofuta

Bokgoni

Sebaka

Multilayers(4-28)、HDI(4-20)Flex、Rigid Flex

Lehlakore Habeli

CEM-3, FR-4, Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

Lisebelisoa tse ngata

4-28 le dikarolo, botenya boto 8mil-126mil (0.2mm-3.2mm)

Ho patoa/Ho foufala Ka tsela

4-20 le dikarolo, botenya boto 10mil-126mil (0.25mm-3.2mm)

HDI

1+N+1,2+N+2,3+N+3,Lera lefe kapa lefe

Flex & Rigid-Flex PCB

1-8layers Flex PCB ,2-12layers e thata-flexible PCB HDI+Rigid-flex PCB

Laminate

 

Mofuta oa Soldermask(LPI)

Taiyo、Goo's、Probimer FPC.....

Soldermask e nang le peelable

 

Enke ea carbon

 

HASL / Etela HASL ea mahala

Boima: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Motlakase.Khauta e Thata

 

Tine e teteaneng

 

Bokgoni

Tlhahiso ea 'Misa

Min Mechanical Drill Hole

0.20 limilimithara

Min.Laser Drill Hole

4mil (0.100mm)

Bophara ba Mola/Sebaka

2mil/2mil

Max.Boholo ba Panel

21.5" X 24.5"(546mm X 622mm)

Bophara ba Mola / Mamello ea Sebaka

Ho roala ha elektronike: +/- 5um, Ho roala ha motlakase: +/- 10um

PTH Hole Mamello

+/-0.002inch(0.050mm)

NPTH Hole Mamello

+/-0.002inch(0.050mm)

Mamello ea Sebaka sa Hole

+/-0.002inch(0.050mm)

Hole to Edge Mamello

+/-0.004inch(0.100mm)

Mamello ea Edge to Edge

+/-0.004inch(0.100mm)

Mamello ea Lera ho Layer

+/-0.003inch(0.075mm)

Mamello ea Impedance

+/- 10%

Warpage %

Boholo≤0.5%

Theknoloji (Sehlahisoa sa HDI)

ITEM

Tlhahiso

Laser ka Drill / Pad

0.125/0.30 , 0.125/0.38

Sefofu ka Drill/Pad

0.25/0.50

Bophara ba Mola/Sebaka

0.10/0.10

Ho thehoa ha lesoba

CO2 Laser Direct Drill

Haha Boitsebiso

FR4 LDP(LDD);RCC 50 ~ 100 micron

Cu Botenya Leboteng la Hole

Blind Hole: 10um(min)

Aspect ratio

0.8 :1

Theknoloji (Flexible PCB)

Morero

Bokgoni

Roll to roll (ka lehlakoreng le leng)

EE

Roll to roll (habeli)

NO

Bophahamo ba molumo oa ho rola limilimithara

250

Bonyane ba boholo ba tlhahiso mm

250x250

Boholo ba boholo ba tlhahiso mm

500x500

Sekhechana sa Kopano ea SMT (E/Che)

EE

Bokhoni ba Lekhalo la Moea (E/Che)

EE

Tlhahiso ea poleiti e tlamang e thata le e bonolo (E / Che)

EE

Maemo a maholo (a thata)

10

Lera le lelelele ka ho fetisisa(Letlapa le bonolo)

6

Material Science 

 

PI

EE

PET

EE

Electrolytic koporo

EE

Sekoahelo sa koporo sa Anneal

EE

PI

 

Ho koahela mamello ea ho lumellana ha filimi mm

±0.1

Filimi e nyane e koahelang mm

0.175

Matlafatso 

 

PI

EE

FR-4

EE

SUS

EE

EMI SHIELDING

 

Enke ea silevera

EE

Filimi ea Silevera

EE