Mefuta e fapaneng ea lihlahisoa tsa Flexible & Rigid Flex PCBs tseo Fumax e ka fanang ka tsona:

Li-PCB tse bonolo

•Likarolo -- Liboto tsa potoloho tse hatisitsoeng tse feto-fetohang tse thehiloeng ho polyimide, ho tloha lehlakoreng le le leng ho isa ho multilayer flex.E bobebe ebile e tšesaane, e thusa ho fokotsa boholo le boima ba lihlahisoa tsa elektroniki.Boima ba lithapo bo phahameng, ho kobeha ho sa lefelloeng, ho tsoelipana le ho phutha, ho tenyetseha ho hoholo, phallo e ntle haholo ea mocheso le ho soasoa ka bongata ba batho ba SMD le ho tlala.

•Bokhoni -- Mofuta oa Boitsebiso (PI/LCP/PTFE);Lera (1-10);Botenya ba The Finished Product (0.1-0.8mm);Boemo ba The Finished Product (9 * 22inch);Minimum Bending Radius (3-6 linako tse botenya);Bophara ba Line/Sebaka (2.5/2.5mil);Ho nepahala ha Dimension (±0.05mm)

 

Li-PCB tse bonolo

•Likarolo -- Lisebelisoa tsa FR4 tse tšesaane, tse mahlakore a mabeli.Boholo ba lipotoloho tse hlano tse kobehang ka radius e kobehang ea 5mm.Litharollo tsa flex-to-install tsa theko e tlaase.Soldering ntle le ho baka pele.Kaho e tsitsitseng haholoanyane, ho nolofatsa ho tšoara nakong ea kopano.

•Bokhoni -- Lisebelisoa (FR4 (125µm Dielectric));Lera (2 Layer PTH);Botenya ba The Finished Product (0.15 mm - 0.18 mm);Botenya ba Koporo (18µm / 35µm / 70µm);Min.Mohala / Sebaka (50µm / 50µm);Max.Boholo ba PCB (580 mm x 500 mm);Mokotla o Monyane ka ho Fetisisa (0.2 mm).

 

Li-PCB tse thata-tse feto-fetohang

•Likarolo -- Ho kobeha mahala le ho hanyetsa ho phunya.Phokotso ea Boima.Botšepehi bo phahameng le 3D Mounting.Liboto tsa potoloho tse hatisitsoeng tse nang le libaka tse thata le libaka tse feto-fetohang tse nang le lipalo tse fokotsehileng tsa mekato.Motsoako oa polyimide le FR4, kapa FR4 le laminate e tšesaane.Liboto tsa potoloho tse hatisitsoeng tse thata tse kopanyang liboto tse thata ntle le tlhoko ea likhoele kapa likhokahano, e leng se etsang hore ho be le phetiso e ntle ea mats'oao.E na le baahi ba SMD le ba sa tlaleng.Libaka tsohle tse sebelisoang hangata li fumaneha.

•Bokhoni -- Sebopeho (Multilayer Flexible Paging kapa Bonding Structure/HDI Structure);Lera (2-20); The Width of Minimum Flexible Zone (3mm);Bophara ba Mola / Sebaka (Inner: 3 / 3mil, Outer: 3.5 / 3.5mil);Bonyane Bonyane ba Diameter (0.10mm(Mechanical Drilling),0.15mm(Laser Drilling));Bophahamo bo fokolang ba Ring (4mil);Sebaka Pakeng Tsa Hole abd Conductor (Layer≤6:5mil, 7≤Layer≤11:6mil, Layer≥12:8mil）;Plate Thickness le Aperture Ratio (1: 1 (Blind Via); 16: 1 (Ka Via));Ho nepahala ha Dimension (± 0.1mm (haholo-holo ± 0.05mm));Mokhoa oa ho sebetsa ka holim'a sefahleho (ENIG/ENEPIG/HASL/FLASH GOLD/HARD GOLD/OSP).

 

Li-PCB tse feto-fetohang ho Aluminium

•Likarolo -- Aluminium kapa lisinki tsa mocheso oa koporo.E fumaneha ka thepa ea bonding ea thermally conductive kapa prepreg (0.3-3.0 W/(m•K)).E fumaneha ka mofuta oa punched, kapa router.

•Bokhoni -- Lisebelisoa (Polyimide);Lera (Lehlakore le le Leng - Lera la 3);Botenya ba The Finished Product (50µm - 1200µm (ho kenyeletsoa Stiffner));Botenya ba Koporo (9µm / 12µm / 18µm / 35µm);Min.Mohala / Sebaka (65µm / 65µm (LDI));Libaka (OSP/ Tin ea ho qoelisoa / qoelisoa Ni / Au / Plated Ni/Au);Mokotla o Monyane ka ho Fetisisa (0.2 mm).